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v3.3.3
Abstract:
3-dimensionally integrated digital silicon photo-multipliers (3DdSiPMs) are being developed by the University of Sherbrooke in Quebec in collaboration with Teledyne-DALSA. They are foreseen as the optimum solution for applications ranging from direct dark matter search to Time-of-flight positron emission tomography to LiDAR (Light Detection And Ranging) systems. The Canadian group is developing a 3DdSiPM solution within the nEXO collaboration for the detection of liquid Xenon scintillation light. The nEXO experiment is searching for the possible neutrino-less double beta decays in Xenon, which requires extremely low level of intrinsic radioactivity within the material used in the experiment and therefore rules out the use of photo-multiplier tubes. 3DdSiPMs are assemblies of at least 2 silicon chips, a photo-detector tier and an electronics tier. The photo-detector tier is an array of single photon avalanche diode (SPADs) similar to analog SiPMs but without quenching circuit. Indeed, every SPAD is directly connected to a quenching circuit located in the electronics tier chip. In addition to quenching the electronics chip typically includes avalanche (induced by photons or other nuisance phenomena) counting and time stamping capabilities. Imaging capability is also possible by recording the location of each avalanching SPAD, though it is not investigated in the current development cycle. In this talk, we will describe the 3DdSIPM concept and the current status of the R&D. We will focus on applications in liquid Xenon and liquid Argon that are currently the focus of the R&D in Canada and are particularly challenging because it requires the detection of Vaccum Ultra-Violet photons at 175nm for Xenon and 128nm for Argon. Finally, we will briefly describe a few applications outside the detection of scintillation light in liquid Xenon and liquid Argon.