Hybrid Lithography and 1-D Layout

by Michael Smayling (Senior VP at Tela Innovations, Inc.)

Wednesday 21 Jan 2015, 16:00 → 17:00 US/Pacific

50A-5132 (LBNL)

This talk will be based on two prior conference presentations: "Sub-20nm Hybrid Lithography enabled by Highly Regular Layout,Pitch Division, and e-Beam Exposure" at EIPBN-2012 and "1D Layout Style: the Cost-Effective Direction for IC’s to sub-10nm" at Radiation Hard Electronics Technology 2014.
The hybrid concept combines four existing technologies: circuits designed with highly regular layout, optical lithography for “lines” at pitches of >80nm, spacer-based pitch division, and e-beam-based lithography for “cuts” and holes.
The semiconductor industry is moving to highly regular designs, or 1D gridded layouts, to enable the above scaling to advanced nodes, as well as improve process latitude, chip size and chip energy consumption. Methods and challenges of 1D circuit layout will be discussed.
For more about the speaker and about Tela Innovations visit http://www.tela-inc.com